Electron Beam Evaporation or (EB) evaporation is a style of physical vapor deposition, where a block of the material (source) to be deposited is heated to where it starts to boil and evaporate. Then it is allowed to condense on a substrate. This process takes place inside a vacuum chamber, with a thin layer of the anode timber. A thickness of less than one micrometre is generally called a thin film while a thickness as compared to one micrometre is called as Thin Film Coating.
Electron Beam (eb) evaporation coatings process falls correct larger category of process known as Physical Vapor Deposition (PVD). Deposition processes are used to release a material from a source and transfer that material to a substrate, forming a thin film coating. PVD processes are commonly used for the deposition of metals; because they can be performed at lower process risk and cheaper relating to materials cost than Chemical Vapor Deposition (CVD).
The electron beam (eb) evaporation coatings process typically involves the following components:
Thin film deposition is often a process carried out in optics industries to impart the desired reflective properties while, in the aerospace industry to form thermal and chemical barrier coatings to protect the surfaces against corrosive environments, in semiconductor industry to grow electronic materials and elsewhere in industry to modify surfaces to experience variety of shapes. Deposition process could be broadly classified into physical vapor deposition (PVD) and chemical vapor deposition (CVD).
When the vapor source is because of a liquid or solid material the process is called physical vapor deposition (PVD). When the source is in a chemical vapor the process is called low pressure chemical vapor deposition or, if in the plasma, plasma enhanced CVD or 'plasma assisted CVD'. Often find PVD and CVD processes are found the same or connected processing chambers.
Electron beam evaporation is often a commonly used process for coating lenses and filters with anti-reflection, scratch-resistant or other specialized coatings. The process is also commonly used for coating insulating and resistor films on electronic areas.
Electron beam physical vapor deposition yields a high deposition at relatively low substrate temperatures, with quite high material utilization efficiency. The material utilization efficiency is high relative because of other methods and the process, you are structural and morphological associated with films. Due to the very high deposition rate, this process has potential industrial application for wear resistant and thermal barrier coatings in aerospace industries, hard coatings for cutting and tool industries, and electronic and optical films for semiconductor industries.
There are various methods used for Thin Film Coatings, which include the following: Electron Beam Evaporation, Thermal Evaporation, Ion-Beam Sputtering and Magnetron Sputtering.
There are various industries, which is equipped with a wide number of vacuum deposited thin films for the medical, telecommunications, industrial, military, aerospace, and fiber-optic markets.